GLOBAL WAFER BACK SIDE COOLING SYSTEM MARKET

INTRODUCTION

 In order to further assure constant wafer temperature, a stream of helium gas is typically allowed to flow to the backside of the wafer holder, the surface of the holder opposite the wafer. This process is known as backside cooling.The process of encasing one or more discrete semiconductor devices or integrated circuits (IC) for security begins with the wafer back side.

Back side reduces wafer thickness to enable stacking and high-density IC packaging, also known as wafer thinning or wafer lapping.A wafer is a piece of semiconductor material that is shaped like a very thin disc and made of silicon, one of the most prevalent semiconductors in use today.

Silicon-based photovoltaic cells and electronic integrated circuits (ICs) are both made from wafers. The wafer acts as the substrate in these designs.A wafer is a thin, crisp, frequently sweet, flat, light cookie that is frequently used to top ice cream and other sweet meals. Wafers can also be used to create cookies that have cream flavour between them.

GLOBAL WAFER BACK SIDE COOLING SYSTEM MARKET SIZE AND FORECAST

The Global wafer back side cooling system market  accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

Wafer temperature control in chambers used in semiconductor manufacturing processes is made possible by HORIBA's release of the GR-500 Wafer Back Side Cooling System. High vacuum conditions can be precisely controlled by the GR-500, and it has a high degree of accuracy in monitoring gas flow.

Through the use of this method, semiconductor manufacturing operations can yield more product and use less energy.Wafer temperature control is crucial for consistently producing semiconductors of the highest quality.

In vacuum procedures, wafer temperature management involves injecting minuscule volumes of cooling gas onto the wafer's back side to boost thermal conductivity for heating and cooling.

Installed on lines leading to vacuum chambers are the GR series wafer backside cooling systems that HORIBA created and sells. This enables precise control of the temperature of wafers and provides dependable and highly exact pressure management of cooling gases.

COMPANY PROFILE

• Horiba
• SPTS tech
• Evatec
• CERN Indico
• Visitech

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many wafer back side cooling systems are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global wafer back side cooling system and key vendor selection criteria
3. Where is the wafer back side cooling system manufactured? What is the average margin per unit?
4. Market share of Global wafer back side cooling system market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global wafer back side cooling system in-house
6. key predictions for next 5 years in Global wafer back side cooling system market
7. Average B-2-B wafer back side cooling system market price in all segments
8. Latest trends in wafer back side cooling system market, by every market segment
9. The market size (both volume and value) of the wafer back side cooling system market in 2023-2030 and every year in between?
10. Production breakup of wafer back side cooling system market, by suppliers and their OEM relationship