GLOBAL WAFER BONDING SILICONE SEALANT MARKET

INTRODUCTION

A procedure known as "wafer bonding" involves two mirror-polished wafers of any material adhering to one another at ambient temperature without the use of any external force or macroscopic adhesive layer. Van der Waals force is utilised to achieve the bonding.

The semiconductors used to make chips for electronic devices like microchips are called silicon wafers. These semiconductors are used to create integrated circuits because of the characteristics of the electricity flowing through silicon wafers.

Glass wafers can be connected to the surface of silicon wafers or other metal substrates using anodic bonding without the need for an additional intermediary layer. 

GLOBAL WAFER BONDING SILICONE SEALANT MARKET SIZE AND FORECAST

The Global Wafer bonding silicone sealant market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

NEW PRODUCT LAUNCH

Temporary Bonding Adhesive For Handling Thin Wafers Is Introduced By AI Technology, Inc. Electronic devices need to get smaller and smaller, which calls for thinner wafers and lower profile heights and footprints.

When working with thin wafers in the past, it was common practice to temporarily attach the wafer to a carrier and employ a temporary coating layer to protect the wafer. Thin wafer handling is essential for fan-out wafer-level packing and 3D packaging; the wafer must not twist, bend, or shift during any wafer-processing phases.

Depending on the processing processes, such as etching, metallization, CMP, PVD, RDL in embedded, fan-out, and 3D wafer-level packaging, these wafer processing procedures may include various temperature ranges and exposure to various chemicals.

AI Technology, Inc. (AIT) created high temperature wafer processing adhesives (WPA) that can endure processing temperatures up to 330oC for higher temperature processing.

The ability of these WPA materials to withstand acids and bases throughout the etching procedures is also crucial. The thermal and chemical resilience of the adhesive enables the thin wafer to be removed from the wafer handler/carrier by heat-sliding or by laser de-bonding equipment while still maintaining its chemical integrity.

COMPANY PROFILE

• Wacker
• AI technology
• Inseto
• Vitrochem Technology
• Fasto

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many  Wafer bonding silicone sealants are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Wafer bonding silicone sealant and key vendor selection criteria
3. Where is the  Wafer bonding silicone sealant manufactured? What is the average margin per unit?
4. Market share of Global Wafer bonding silicone sealant market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Wafer bonding silicone sealant  in-house
6. key predictions for next 5 years in Global Wafer bonding silicone sealant  market
7. Average B-2-B Wafer bonding silicone sealant market price in all segments
8. Latest trends in Wafer bonding silicone sealant market, by every market segment
9. The market size (both volume and value) of the Wafer bonding silicone sealant  market in 2024-2030 and every year in between?
10. Production breakup of Wafer bonding silicone sealant market, by suppliers and their OEM relationship