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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
The invention offers a specific type of wafer cassette cleaning device for cleaning wafer box slits. This device consists of the following: having the brush of some row brush heads and connecting the fixture of described brush.
having the described brush of every row around the rotating shaft setting of described brush corresponding with a described wafer cassette slit, matching the distance between adjacent brushes with the distance between adjacent slots, and making the described brush rotate while the described brush is in the process of rotating.
The invention also includes instructions on how to use the wafer cassette cleaning apparatus. the brush-on-brush cleaning method for wafer cassettes and the cleaning apparatus supplied by the innovation Once the wafer cassette slit has been cleaned, any particles that managed to become lodged there have been removed, making it simple to use deionized water to clean it once more.
The wafer cassette that holds wafers is often used in the semiconductor manufacturing industry, and only needs to be cleaned afterwards. Process in the first wafer cassette is bathed in deionized water; Use deionized water again to make crystals On the surface of the circle box, spray irrigation is used.
Hot nitrogen is then used to dry the surface. Wafer cassette cleaning is done in this manner. Slit for bearing wafer can't be totally cleaned out, thus there's still crystalline material in there where the wafer will be. On the impact of a wafer, the circle box cut has greater cleanliness.
The Global Wafer Cassette Cleaning Machine market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Launch of the CELLESTA SCD single wafer Cassette cleaning technology by Tokyo Electron. The CELLESTA line of products from TEL is frequently used to clean silicon wafers for use in the production of semiconductors.
The soon-to-be-available CELLESTA SCD incorporates a special supercritical drying chamber on the CELLESTA platform, which has been successfully used in mass production.
Low surface tension alcohol solutions are typically used in the drying step of wafer cleaning. However, pattern collapse during the drying process has emerged as one of the main problems as a result of continuing semiconductor scaling and the usage of multi-layer architectures in highly advanced devices.
TEL created a pattern collapse-free drying technique using a supercritical fluid in response and introduced the technology to the market as machinery for mass manufacturing. Therefore, the urgent problem of wafer cassette slit cleanup must be resolved
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |