GLOBAL WAFER CLAMPING SYSTEM MARKET

INTRODUCTION

 The wafer is held during processing by the electrostatic chuck (ESC), which is used in many semiconductor processes. For "chucking" the wafer, ESCs use a platen with integrated electrodes that are driven with high voltage to create an electrostatic holding force between the platen and wafer.

Currently, the majority of process tool manufacturers handle high voltage power sources with low speed DC signals.As a result, they are able to regulate the voltage set-points and sequencing of the ESC's clamp and de-clamp operations.

The technique limits the intricacy of the bias signals that can be applied to the ESC while still enabling basic ESC functionality. Trek has added a microprocessor-controlled arbitrary waveform generator along with a high speed.

high voltage amplifier and an electrostatic voltmeter in order to generate more sophisticated waveforms. By adjusting the ramp, overshoot, and length of the HV signal, a variety of clamp sequences can be created and monitored to improve the clamping and declamping process' performance.  

GLOBAL WAFER CLAMPING SYSTEM MARKET SIZE AND FORECAST

The Global Wafer clamping system market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

Okmetic launched the Wafer clamping system, Terrace Free SOI feature. Device manufacturers may generate more chips per wafer thanks to the Terrace Free SOI wafers' enhanced useable area.

The Terrace Free SOI wafers offer a noticeable, approx. 4%, increase in the active area compared to the typical SOI terrace, which is around 2 mm. Additionally, the edge exclusion area decreases from 4.5 mm to 3.0 mm, increasing the Fixed Quality Area by roughly 3%.

  The edge of Terrace Free SOI wafers is optimally beveled to improve compatibility with ensuing device processing. Terrace Free SOI wafers, for instance, can make the lithography process, including resist coating, and epitaxial growth and handling easier.

Terrace Free SOI wafers were created by Okmetic with the goal of satisfying customer and market demands. Okmetic has to create a new type of optimized SOI process in order to be able to produce a totally Terrace Free SOI wafer.

Okmetic is grateful for the opportunity to work closely with a number of pilot clients during the development stage. These clients provided insightful comments on the Terrace Free SOI wafer prototypes, enabling a quicker development period and a successful production ramp-up.

COMPANY PROFILE

• Okmetic
• SHINKO
•  TOTO
•  Lam Research
•  Creative Technology

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Wafer clamping system are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Wafer clamping system and key vendor selection criteria
3. Where is the Wafer clamping system manufactured? What is the average margin per unit?
4. Market share of Global Wafer clamping system market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Wafer clamping system in-house
6. key predictions for next 5 years in Global Wafer clamping system market
7. Average B-2-B Wafer clamping system market price in all segments
8. Latest trends in Wafer clamping system market, by every market segment
9. The market size (both volume and value) of the Wafer clamping system market in 2023-2030 and every year in between?
10. Production breakup of Wafer clamping system market, by suppliers and their OEM relationship