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By comparing the circuit pattern images of the adjacent dies, the wafer defect detection system finds faults. As a result, systematic flaws can go undetected by a wafer defect inspection system. A bare wafer or a patterned process wafer can both be subjected to inspection.
It’s critical to inspect wafers for faults like scratches, exposure issues, wafer edge flaws, spin flaws, hot spots, particle contamination, and a wide range of other flaws that could affect chip performance.
A wafer is a very thin disc-shaped chunk of silicon or another semiconductor material. Silicon-based photovoltaic cells and electronic integrated circuits (ICs) are both made from wafers. The wafer acts as the substrate in these designs.
The Global Wafer Defect Detection Equipment market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
A vital part of every semiconductor manufacturer’s metrology capabilities, Hitachi High-Tech Corporation (“Hitachi High-Tech”) today announced the release of the Hitachi Dark Field Wafer Defect Inspection System DI2800. Designed to find imperfections and particles on patterned wafers up to 8 inches (200 mm) in diameter, the DI2800 is a high-speed metrology instrument.
The DI2800 can help assure device dependability and safety because of its high throughput and performance, especially in highly sensitive applications like the Internet of Things (IoT) and the automotive industry, where 100% inspection is necessary.
Dark Field Wafer Defect Inspection System DI2800 was created by Hitachi High-Tech in response to these market demands. In order to improve the lighting and detection optics for this product, scattering-intensity simulation technology is used. This enables highly sensitive examination of patterned-wafer flaws created during the production process.
On mirrored wafers, it offers a detection sensitivity of 0.1-m for standard particle size. Even on devices as small as 0.3 mm square, which have previously proven difficult due to sensitivity and data processing restrictions, this performance is now feasible. The DI2800 is capable of throughputs of over 40 200-mm wafers per hour with a highly tuned inspection procedure.
