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It is also known as an edge grinding machine, a beveling machine, and a rounding machine. Substrates and wafers have their edges ground by it. With Icon Buttons and a Touch Panel Display, the operation is simple.
Wafer edge grinding equipment also attracts interest as a remedy for the yield loss caused by the knife edge of the device wafer in the back end process. In recent years, it has been increasingly important to improve the wafer edge’s quality across the whole semiconductor manufacturing process, from the creation of wafers through the creation of devices.
The Global Wafer Edge Grinding machine market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Equipment for grinding the edges of 8-inch semiconductor wafers is developed by NTS. With the aid of this machinery, any required shape may be accurately formed from the wafer’s outer diameter. Using a diamond wheel, the machinery grinds the 8-inch wafer’s edge and outside diameter. Customers’ preferred sizes and shapes for wafers can be properly processed.
The minimum vibration, or load, that has an impact on wafer processing quality is a major feature of NTS’ “Edge Grinder.”
The Edge Grinder uses precision CCD sensors to precisely identify wafer positions and wafer shapes. Users can position the wafer with the work spin and minimise the equipment load with the precision spin, which makes the production efficiency and speed greater than that of competitors.Additionally, NTS is pressing for talks to deliver 8-inch equipment.
“By being more productive and competitively priced in comparison to rivals in the primary international equipment market, such as Japanese equipment, we will progressively increase our market share of semiconductor grinding equipment.
A 6-inch Edge Grinder was previously mass-produced by NTS. Since its growth the previous year, it has provided 6-inch machinery to Zhonghua Semiconductor, China’s top manufacturer of semiconductor wafers. Due to recent additional orders, more than 30 units of equipment will be delivered to international wafer makers by the first half of this year.
