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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
A wafer is raised from a Semi-Standard carrier using a tool called a wafer elevator, which must be physically operated.
Until the mechanism is released, the wafer is held in an elevated posture. The operator can choose to elevate every fifth wafer, beginning at slot 1â5. (for example, every wafer in slot 1, 6, 11, 16, 21).
By using organic materials and an open design, the clean room's laminar movement is not interfered with while handling is kept incredibly clean.
The Global Wafer Elevator Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Wafers with diameters of 6" (150mm) and 8" (200mm) can be thoroughly evaluated with an optical microscope or video measurement systems, such as the Nikon NEXIV, with the help of Nikon's cutting-edge, completely equipped NWL200 wafer elevator.
The Nikon NWL Series is an excellent line-up of semiconductor wafer loaders that can transfer wafers with diameters of 6" (150mm) and 8" (200mm) down to a thickness of 100 microns (option) onto Nikon Eclipse L200N and LV150N microscopes or a NEXIV VMZ-S video measuring system.
High precision, accuracy, and speed are offered for semiconductor inspection in a manufacturing setting by the combination of the NWL200 wafer loader and a Nikon NEXIV video measuring system.
The macro arm's vacuum chuck is still operational in the event of an unanticipated power outage, enabling secure wafer removal. It is supported to inspect the centre region, back periphery, and front side pattern of semiconductor wafers.
It is possible to manually or automatically select the wafer rotation speed and tilt angle. Using a multi-arm system and a quick wafer cassette elevator with a non-contact centring mechanism, wafers can be loaded and unloaded with the greatest level of accuracy.
The NWL200 has an ergonomic design that makes it simple to use and manage. Wafer in-slot location and complete cassette exchange are simple when the position is 35 degrees to the left.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |