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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
laser marking device for wafers. Due to its obvious benefits, including high marking precision, quick speed, and permanent marking, laser marking is widely employed in the semiconductor sector. Good marking quality is necessary for wafer marking on the die.
Traceability and reliability will be ensured by high cleanliness standards. To ensure complete process chain traceability, a laser is employed to print the lot number immediately above the wafer. There are numerous recessed holes in this lot number.
After marking, several derivatives might exist and collect near the pits. In the following process, excessive or harsh protrusions could scratch the water's surface and force it to be scrapped.
The cold processing technique of ultraviolet laser processing eliminates buildup, making it the best wafer marking programme.
Use automated machines that give high precision with little heat damage to carry out high-speed silicon wafer etching, marking, and glass scribing for NGS Flow Cell production.
Wafer Lase systems include a laser source, beam delivery optics, robotic part handling, automated part alignment, and control and interface software. For optimal stability, system components are set on a granite base inside of a welded steel frame.
The Global Wafer CassetteMarket accountedfor $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
For laser wafer annealing, Focuslight Technologies has introduced the DLightS series Diode Laser System. This system combines beam transformation and beam homogeneity technology for photon control with eutectic bonding technology, thermal management, and thermal stress control technology for photon generation.
It also performs extra tasks like monitoring the processing temperature and detecting the quality of the output beam in real time. One of the essential important procedures in the production of logic chip technology nodes and down is laser annealing.
This method efficiently reduces wafer electrode flaws in the process, improves product performance, and increases production yield by rapidly heating the wafer surface atomic layer.
Laser annealing technology eventually took the place of traditional furnace annealing and has now established itself as the industry standard due to advancements in semiconductor manufacturing technology, Very-large-scale integration (VLSI) design, and manufacturing capacity.
Laser annealing has many benefits over traditional annealing technologies, including selective heating, closed-loop temperature control, high power density, and steady energy output. It is appropriate for a variety of annealing techniques, including uniform temperature annealing, peak annealing, and flash annealing.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |