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The process of putting semiconductor wafers onto a substrate, most frequently a carrier tape or a film frame, is known as wafer mounting.
The wafer is properly aligned and stable during the succeeding processing steps thanks to the mounting procedure, which is essential in the production of semiconductor devices.
The device typically consists of a vacuum chuck or a robotic arm that removes the wafer from a cassette or carrier and sets it on the substrate.
To ensure precise placement and bonding of the wafer to the substrate, the device may also have features like alignment sensors, edge grip mechanisms, and adhesive dispensing systems.
Microprocessors, memory chips, and other kinds of integrated circuits are produced using wafer mounting machines among other uses. They are often found in “fabs,” or semiconductor fabrication facilities, where semiconductor devices are mass-produced in large quantities.
The Global Wafer Mounting Machine Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Prior to the singulation/dicing process, UVFAB wafer mounting solutions laminate tape/film to wafer and dicing frames without bubbles.
The yield is improved through a repeatable and robust wafer mounting technique from research and development to semi-production, they offer a broad range of wafer mounting tools. Please review the list of products we offer below.
WAFER MOUNTING SYSTEMS FOR MANUAL USE (224 SERIES)
Three alternative wafer sizes are supported by our manual wafer mounter series: 300mm (12′′), 200mm (8′′), and 150mm (6′′). These hand-operated wafer mounting devices can be produced for back-grind or diced film laminating.
Our wafer mounters can be applied to a variety of substrates, including wafers, packaging, glass, ceramic, and other materials. If necessary, they can also be modified to fit unique user requirements.
The 334 series wafer mounter is perfect for various lamination and tape application scenarios. This approach satisfies the needs of the user for a manual operation that is automated just for critical application tasks, allows for user-settable application conditions, and provides for quantitative control of quality. Both pre-cut and regular tape were considered when creating this model.
The first versatile wafer mounter in the market, it may be customized for the following uses in addition to serving as a specific wafer mounter for pre-cut or regular tape.
It has 300mm (12 inches) in Mode FM-6643 automated wafer mounting machine and 200mm (8 inches) in Mode FM-6648 automated wafer mounting machine.
