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To make sure that cards are prepared and capable of testing semiconductor devices, automated probe card test and repair is utilized to keep track on probe card health. Repairs like tip adjustment or card cleaning can be done when a card is not performing according to specification, swiftly bringing the card back to production.
In essence, a probe card is a board or interface that is used to do wafer testing on a semiconductor wafer. Before being produced and transported, integrated circuits on a wafer are tested for electrical characteristics and performance via this connection to the ATE.
Take the production of semiconductors as an example to see how to simplify the process. Several integrated circuits are positioned on a semiconductor wafer during the manufacturing of silicon.
After being chopped, packaged, and sent, this wafer. However, the functionality of the circuits must be verified before packaging is done. A probe card is used to help with this electrical test.
To establish an electrical path between the semiconductor wafer and the tester, the probe card is installed into a prober and connected to the tester. The probe card subsequently connects with the pads of the integrated circuit chips on the wafer using its metallic elements or needles to transmit the electrical data and necessary test parameters.
The Global Wafer probe card test and analysis system market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The advent of MicroLign technology, a fresh approach to probe tip design created to enhance automatic optical alignment during wafer probing, was launched by formfactor, a pioneer in high-tech wafer test probe cards.
ACCRETECH, a well-known provider of high-performance automated probe systems, was also announced by the firm as having agreed to assist the MicroLign technology with a new automated alignment method.
The combined initiative between the companies has produced a quicker, more precise optical alignment technique that has reduced optical alignment mistakes during testing by more than 80%.
Greater manufacturing efficiency for high volume wafer test operations are enabled by MicroLign features working in tandem with ACCRETECH’s innovative software to significantly extend productive time in the test cell.
