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Machines called wafer probers are necessary to electrically test the wafers of individual chips. In order to ensure the highest level of positioning precision, the Prober loads and handles the wafer completely automatically. A probe card, a test unit, and a wafer probe make up a complete test cell.
In addition to operating with the highest precision possible due to the most recent technology, flagship wafer probers for wafers up to 200 mm or 300 mm in diameter also guarantee maximum capacity and productivity with their above average and high throughput.
The Global Wafer Probing Machine market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
SEMISHARE launched the A12 fully automatic wafer probing machine for mass production. The cutting-edge A12 probe station on display this time features technologies like automatic wafer loading and unloading, micron-level full-closed-loop motion control, automatic precise needle alignment of Wafer, automatic and precise visual calibration, high-speed feedback communication, and data information processing.
The aspect has undergone a new upgrade and improvement, and the apparatus now uses a highly stable wafer probe testing technology. Furthermore, the company’s in-house built software, which is more functional and compatible, is used by the A12 probe station.
The A12 probe station software offers robust wafer map editing capabilities, offline and file import and export capabilities, PMI needle mark detection capabilities, pre-alignment capabilities, device, configuration, and utility parameter independent management capabilities, high-resolution and high-precision temperature control capabilities, and a variety of precision compensation algorithms.
32-bit BIN sub-function, GPIB, TCP/IP, and other test machine connection protocols are all supported. support the MES communication in the production and the SECS/GEM protocol.
The Wafer ID identification feature, support for dots, dashes, and middle special characters like bars, high-speed image autofocus, support for various needle cards, multi-site location, and other features offer impressive performance.
The primary purpose of the probe station is to evaluate and categorise the die parameter features, which is useful for later process screening.
The demand for probe stations that can handle the testing needs of high-power devices and meet users’ various performance testing requirements in high and low temperature environments will rise with the rise of 5G base stations, new energy vehicles, fast charging, and photovoltaic industry applications.
The power semiconductor market space represented by SiC and GaN is growing steadily. The machine’s present development requirements are mostly focused on the machine’s adaptability, stability, test effectiveness, acceptance and use by the terminal operation, and delivery time.
