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Wafers’ precise thickness is measured using capacitive displacement sensors. The thickness is detected by two opposing sensors, together with other data like deflection or sawing marks. The wafer’s placement within the measurement gap may change.
Although the amount of material removed varies depending on the type of device, a typical semiconductor wafer may start out with a thickness of 775 m. For instance, the thickest wafers, which are 100 m thick, are employed for logic gates. Instead, 50 m thick semiconductor wafers are often needed for DRAM memory.
the separation between two locations on a wafer’s front and rear surfaces that correspond. Microns or mils are used to measure thickness (thousandths of an inch). Vernier calliper is used to measure length, whereas screw gauge is used to determine thickness.
The global Wafer Thickness Measuring Equipment market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The fastest Integrated Metrology system currently available for high-end 300mm chemical mechanical polishing (CMP) applications is the NovaScan 3060, according to Nova Measuring Instruments Ltd. (NASDAQ: NVMI), the market leader in integrated measurement and process control for the semiconductor industry.
The NovaScan 3060 is compatible with all high-throughput polishers and has a total measurement time of 13 seconds per wafer for 13 sites. This allows measurement and mapping of all wafers both before and after polishing without reducing the polisher’s throughput. Only Nova provides wet and dry integrations for integrated metrology.
This gives clients the option to select the best alternative based on BKM (Best-Known Method) as well as factors like cost and performance. Utilising UV spectrophotometry, the NovaScan 3060 can precisely measure and map the most cutting-edge semiconductor sector applications down to 0.09um technology.
The NovaScan 3060 is a logical addition to the current NovaScan range, allowing semiconductor manufacturers to simply upgrade production lines from 200mm to 300mm and to continue implementing wafer to wafer closed loop management (CLC).
The NovaScan 3060 has high speed and cutting-edge technology in addition to new operating software that supports the device’s enhanced capabilities without compromising usability.
With its proprietary, non-contact in-air and in-water thickness measurement technology, the NovaScan 3060 does not require operator handling or intervention and does not require external validation following cleaning and drying.
