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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
The world's first operational packet-switching network, ARPANET, which subsequently developed into the Internet, implemented the Network Control Protocol (NCP) in its early stages.
Users were able to access and use computers and other devices in distant locations using NCP, as well as send files between machines. Application services like email and file transfer were made possible by NCP, which provided the protocol stack's middle layer.
A single integrated chip (IC), known as a "System on a Chip," or "SoC," contains all of the parts of a typical computer system.
Having a dedicated SOC provides an organisation with multiple benefits, including continuous network monitoring, centralised visibility, reduced cybersecurity costs, and better collaboration.
Cybercriminals will never take a break. Single-band wireless SoCs offer a comprehensive multi-protocol wireless connectivity solution that includes Bluetooth 5 dual-mode and 802.11 b/g/n (2.4 GHz).
The performance of the wireless SoCs is power-optimized and enables high throughput and extended range. The wireless SoCs can be certified by the FCC, IC, and ETSI/CE.
The Global Wi-Fi NCP SoCs market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The new MediaTek Filogic 130 and Filogic 130A system-on-chips have been released by MediaTek (SoCs). The chips combine an AI engine, Wi-Fi 6 and Bluetooth 5.2 subsystems, a power management unit (PMU), and a microprocessor (MCU) onto a single chip.
In order to make it simple for device manufacturers to incorporate voice assistants and other services into their devices, Filogic 130A also has an audio digital signal processor.
These all-in-one solutions offer tiny form factor designs that are perfect for a wide range of IoT devices, as well as energy-efficient, dependable, and high performance connectivity.
Both the Filogic 130 and Filogic 130A provide dual-band 2.4GHz and 5GHz connection, 1T1R Wi-Fi 6, quality of service (QoS), and WPA3 Wi-Fi security.
They also support advanced Wi-Fi features including target wake time (TWT), MU-MIMO, MU-OFDMA, and MU-MIMO.
The solutions feature enhanced Wi-Fi and Bluetooth coexistence to guarantee that users' Wi-Fi connectivity is reliable even when Bluetooth devices are being used concurrently.
Both single-chip solutions include a low noise amplifier (LNA) and a power amplifier (PA) integrated front-end module (iFEM), as well as an Arm Cortex-M33 microprocessor backed by embedded RAM, external flash, and external memory.
Additionally, the Filogic 130A features an integrated HiFi4 DSP for far-field voice processing that is more accurate, an always-on microphone feature with voice activity detection, and trigger word support.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |