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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
GLOBAL WIRE BONDING VISION INSPECTION SYSTEM MARKET
INTRODUCTION
An essential first step in characterising and understanding the causes of flaws in order to discover remedies and prevent them from happening again is wire bonding vision inspection.In bonded wire inspection, 3D stereo imaging techniques are frequently employed.
Powerful machine vision system to inspect wire bonding. An integrated circuit (IC) chip's bonding wire flaws, such as ones that are missing, moved, shorted, or sagged, can be routinely checked for. A unique lighting environment was created to emphasise the bonding wire's slope and prevent the background from being extracted.
By examining the change in the bonded wire slope, which is produced from a single 2-D image, it is possible to identify the 3-D type defect of sagged wire. A few examples are provided to demonstrate the usefulness and potency of the suggested revolutionary wire bonding vision inspection technology.
GLOBAL WIRE BONDING VISION INSPECTION SYSTEM MARKETSIZE AND FORECAST
Global wire bonding vision inspection system market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
NEW PRODUCT LAUNCH
After the die process and wire-bonding process, the PWB1000V utilises the high resolution line scanning vision system technology for visual inspection and yield management. It has an intuitive software interface, picture processing capabilities, a strip mapping procedure, and the capacity to handle up to 5 magazines simultaneously. Additionally, it is built with a fast scanning speed of 75 mm/s.
At 7300, a Stereoscopic Line Scanning Camera System (Dual Sensor).Up to five magazines can be stored using the multiple magazine loader and dual scanning track mechanism (90mm Width Each).Reconstruction of a 3D image at 5700 lines per second.
Quick scanning at 75 mm per second. 20 kHz line rate maximum).Simultaneous 3D Height Map & Color Image.Patented Reflection Technology in a High Brightness LED Illuminator.Image processing system based on Cognex.Multiple PCs Working in Parallel.Classification of Defects Using Four Vision Tools.
COMPANY PROFILE
THIS REPORT WILL ANSWER FOLLOWING QUESTIONS
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |