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Last Updated: Apr 25, 2025 | Study Period: 2022-2030
Thin layers of transition metal nitride typically have a low intrinsic fracture toughness.
They synthesise a number of these materials by DC reactive magnetron sputtering in response to the theoretically expected extremely high potential for toughness for TiN/WN films superlattices and the recently identified fracture toughness increasing superlattice (SL) effect.
The SL coatings exhibit a consistent cubic structure that has been stabilised by vacancy as well as a slight lattice misfit between the TiN and WN layers.
Every mechanical property that was examined showed a clear relationship on the bilayer period,exhibiting a minimum indentation modulus of 387 2 GPa and a hardness peak of 36.7 0.2 GPa.
Particularly when compared to monolithic TiN and WN, the toughness-related values of the SLs exhibit a remarkable improvement, including a tripling of the fracture energy.
The SL configuration increases the fracture toughness from 2.8 0.1 (TiN) and 3.1 0.1 (WN) to 4.6 0.2 MPam. They connect compositional fluctuations and the substantially different elastic moduli to this maximisation.
In order to clarify the obvious trends found for TiN/WN superlattices, they propose DFT-based models to supplement their experimental data.
The Global WN films market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
IAEA study as the working pressure was reduced during the deposition process, the tension in the W film changed from tensile to compressive.
Additionally, the WN film demonstrated compressive stress, which increases N2/Ar ratio and exhibits linear behaviour. The tungsten coating that was sputtered onto the metal gate frequently displayed a high tensile stress of around 2000 MPa.
Based on experimental results, they discovered that W/WN films could be layered with varying amounts of tension and could be built up steadily. The adhesion stability of these films was quantitatively assessed using a scratch tester.
The optimised W/WN multilayer stack could be persistently maintained by adjusting for the tensile stress of the W layer, which reduces the likelihood of film delamination, according to the adhesion test results.
Based on the aforementioned facts from the experiments, they might reduce particle formation that leads to chamber contamination and increase productivity by extending the time that the process chamber is used continuously.
Pasting layers are designed for W sputtering to increase productivity. The residual stress of the pasting layer increases when the Ar flow decreases. Increasing N2 flow causes the residual stress of the pasting layer to decrease.
It was possible to achieve a 21% reduction in particle formation and a suppression of outliers. Film stress reduction helps to create better semiconductors.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |