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Due to characteristics like rapid frame rate, low dark current, high radiation endurance, and low readout noise, scientific Complementary Metal Oxide Semiconductor (sCMOS) devices are being used more and more in X-ray sCMOS Detectors.
A backside-illuminated (BSI) sCMOS sensor with tiny pixel size of 6.5 um * 6.5 um was put through basic performance testing.
The readout noise is 1.6 e, the dark current is 0.5 e/pixel/s, and the energy resolution for single-pixel events is 204.6 eV at a temperature of -20C. Utilising three versions of the sensors with various deletion depths, the impact of depletion depth on the sensor’s performance was also investigated.
The Global X-ray sCMOS Detector market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
A research camera with sCMOS technology that is sensitive to wavelengths from EUV to soft x-ray is called the Sydor Wraith X-ray sCMOS Detector.
Because it is a direct detector, soft x-ray and EUV imaging applications can gain from increased Quantum Efficiency (QE), which occurs when photons are converted directly to charge in the detector Si layer as compared to methods involving scintillators and indirect detection.
Using a back illuminated sCMOS chip that has been modified for maximum sensitivity to photons in the EUV to soft x-ray wavelength range, the Wraith sCMOS camera is further tuned for QE. Without any coatings on the light-sensitive face, the back-illuminated detector’s quantum efficiency is improved at energies below 500 eV.
The dynamic range is extremely outstanding for EUV Ptychography research, with a full well capacity of 77,000 e-. Speed can be further raised to attain frame rates approaching 1 KHz for other applications, such as EUV and soft x-ray spectroscopy, where a full square active area is not necessary.
The system is specifically set up for vacuum-operated soft x-ray and EUV spectroscopy applications as well as soft x-ray and EUV imaging. The design keeps most of the electronics outside of the vacuum environment, leaving only the chip protruding on a specially made carrier board that is UHV compliant.
This method eliminates the possibility of any samples being contaminated and lowers the risk of outgassing from the X-Ray detector, which is essential for soft x-ray imaging.
