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Published Date - March 2024 Number of Pages - 96
High Bandwidth Memory (HBM) is a cutting-edge DRAM technology that offers significantly higher bandwidth compared to traditional DRAM. Designed for high-performance computing (HPC) applications, HBM powers graphics processing units (GPUs) and AI accelerators, enabling them to handle demanding workloads with exceptional efficiency and speed.
The global High Bandwidth Memory (HBM) market is poised for remarkable growth, projected to reach a valuation of USD 6.32 billion by 2028, fueled by a CAGR of 25.86% from 2023 to 2028. This growth trajectory is driven by the surging demand for HBM in HPC applications, coupled with the increasing popularity of high-end gaming and professional graphics applications.
Rising Demand for HPC: HPC applications are increasingly dependent on high-bandwidth memory solutions. HBM perfectly addresses this need by providing significantly higher bandwidth than traditional DRAM technologies, enabling rapid data transfer between the processor and memory.
Growing Popularity of High-End Gaming: High-end gaming applications demand high-performance memory to deliver a smooth and immersive gaming experience. HBM is increasingly being incorporated into high-end graphics cards to meet this demand, ensuring seamless graphics rendering and enhanced gameplay.
Advancement of New HBM Technologies: Continuous advancements in HBM technology, such as HBM3, are introducing even higher bandwidth and lower power consumption capabilities. These advancements are expanding the market for HBM and attracting new applications.
Miniaturization of Electronic Devices: The miniaturization of electronic devices is driving the need for smaller, more compact memory solutions. HBM’s compact form factor makes it suitable for integration into smaller devices, enabling enhanced performance and portability.
Increasing Adoption of AI: AI applications are becoming increasingly demanding in terms of computational power and data processing capabilities. HBM plays a crucial role in AI accelerators, providing the necessary bandwidth to support the massive data processing requirements of these applications.
Growing Gaming Enthusiasm: The popularity of high-end gaming is steadily increasing, driving the demand for high-performance gaming devices. HBM’s superior bandwidth and low latency are essential for delivering smooth and responsive gaming experiences.
Emergence of New HBM Technologies: Advancements in HBM technology, such as HBM3, are pushing the boundaries of bandwidth and power efficiency. These advancements are opening up new applications for HBM and expanding its market reach.
High Cost: HBM is significantly more expensive than traditional DRAM technologies. This high cost can act as a barrier to adoption, particularly for price-sensitive applications.
Complex Integration: HBM integration into systems requires a complex process, leading to higher costs and longer development cycles. This complexity can delay product launches and limit the adoption of HBM.
Limited Availability: HBM’s limited availability can pose challenges for companies seeking to source this high-performance memory. This can limit the development of new products and applications that rely on HBM.
Despite these challenges, the global High Bandwidth Memory (HBM) market is expected to maintain its growth trajectory in the coming years. The continued demand for HPC and AI applications, along with the growing popularity of high-end gaming, will drive HBM adoption. Additionally, advancements in HBM technology, such as HBM4, will further enhance its performance and reduce costs, making it more attractive to a wider range
HBM has a substantially smaller form factor than DDR4 or GDDR5 and provides better bandwidth while consuming less power. Up to eight DRAM dies plus an optional base die including buffer circuits and test circuitry are stacked to achieve this.
Samsung, AMD, and SK Hynix were the first to design High Bandwidth Memory (HBM), a high-speed computer memory interface for 3D stack synchronous dynamic random-access memory (SDRAM).
A board, such as a silicon interposer, is frequently used to link the stack to the GPU or CPU’s memory controller. The demand for rapid information delivery (bandwidth) has grown in tandem with the growth of graphical applications. As a result, HBM memory outperforms GDDR5, which was previously employed in terms of performance and power efficiency, resulting in increased growth.
The Model 5585 and Model 5586 SOSA aligned Xilinx Virtex UltraScale+ high-bandwidth memory (HBM) FPGA 3U VPX modules were just released by Mercury Systems, Inc., a pioneer in reliable, secure mission-critical solutions for aerospace and military.
These are the first 3U open architecture systems available on the market with HBM, which offers a 20x improvement in memory bandwidth over conventional DDR4 memory. This ground-breaking architecture significantly increases signal processing rates to enable compute-intensive applications with limited size, weight, and power (SWaP) such as electronic warfare, radar, signals intelligence, and big data.
Due to Micron’s vast experience in sophisticated memory stacking and packaging, its entry into the High Bandwidth Memory (HBM) market has been straightforward. HBM2E and upcoming HBM technologies are two examples of the Ultra-Bandwidth Solutions that Micron is dedicated to offering.
The world’s fastest memory is required for the compute foundation needed to tackle the most difficult problems. High-performance computing systems and next-generation data centres benefit from the bandwidth, huge parallelism, and power efficiency provided by Micron’s HBM2E.
A HBM memory controller architecture can be verified using the SystemVerilog (SV)-based High Bandwidth Memory (HBM) Verification IP from Atria Logic. The VIP can be customized and is pre-verified. Simply configure and instantiate the VIP like any other design unit to include it into an existing testbench. The user can create test cases to account for all potential input scenarios thanks to the built-in coverage.
SV classes have been used to implement the HBM VIP. The package that contains the class descriptions is imported into a top module. The classes are then instantiated by the module as required. The HBM memory controller design unit needs to be verified, and the module itself needs to be instantiated in the verification environment. Up to 8 channels can be present in an HBM device. The VIP offers class-based implementation of a single channel. A multi-channel HBM device can be simulated by many objects of this class. Each HBM channel has its own interface and functions independently.
The power-up phase kicks off the HBM activity. The reset command is sent during the power-up phase. Waiting for the initial reset, the HBM VIP. The channel is trapped in the power-up phase until this reset is given. When the channel recognizes the reset, it advances to the initialization stage.
With up to 500Mb of total on-chip integrated memory and up to 16GB of high-bandwidth memory (HBM) Gen2 integrated in-package for 460GB/s of memory bandwidth, Virtex UltraScale, HBM FPGAs offer the largest on-chip memory density. Maximum bandwidth, effective routing and logic utilization, and optimized power efficiency are made possible by an innovative embedded HBM controller and ground-breaking integration for workloads that process large datasets from AI inference, video transcoding, next-generation firewalls, search applications, and data warehouses.
A DDR4 DIMM has 20X less bandwidth than 460GB/s of HBM bandwidth. For the maximum useable HBM bandwidth, extended AXI ports and an integrated port switch offer any port to any address access and reduce design size, complexity, and time to market.
ChatGPT is seeing an increase in demand for high-performance memory chips. Emerging AI technologies like ChatGPT are putting a premium on high-performance memory chips. ChatGPT has increased orders for high bandwidth memory (HBM) from Samsung and SK Hynix.
Nvidia receives third-generation HBM from SK Hynix, which is combined with Nvidia’s A100 Gpus for ChatGPT. Nvidia has also incorporated SK Hynix’s fourth-generation HBM inside the H100, which is already serving ChatGPT servers. Furthermore, Samsung has created HBM with computing capabilities, which can not only store but also calculate data. Samsung delivered the product to AMD for usage in AI accelerators.
The Global High Bandwidth Memory (HBM) Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The Model 5585 and Model 5586 SOSA aligned Xilinx Virtex UltraScale+ high-bandwidth memory (HBM) FPGA 3U VPX modules were just released by Mercury Systems, Inc., a pioneer in reliable, secure mission-critical solutions for aerospace and military. These are the first 3U open architecture systems available on the market with HBM, which offers a 20x improvement in memory bandwidth over conventional DDR4 memory.
This ground-breaking architecture significantly increases signal processing rates to enable compute-intensive applications with limited size, weight, and power (SWaP) such as electronic warfare, radar, signals intelligence, and big data.
Due to Micron’s vast experience in sophisticated memory stacking and packaging, its entry into the HBM industry has been straightforward. HBM2E and upcoming HBM technologies are two examples of the Ultra-Bandwidth Solutions that Micron is dedicated to offering.
SV classes have been used to implement the HBM VIP. The package that contains the class descriptions is imported into a top module. The classes are then instantiated by the module as required. The HBM memory controller design unit needs to be verified, and the module itself needs to be instantiated in the verification environment.
Up to 8 channels can be present in an HBM device. The VIP offers class-based implementation of a single channel. A multi-channel HBM device can be simulated by many objects of this class. Each HBM channel has its own interface and functions independently.
With up to 500Mb of total on-chip integrated memory and up to 16GB of high-bandwidth memory (HBM) Gen2 integrated in-package for 460GB/s of memory bandwidth, Virtex UltraScale, HBM FPGAs offer the largest on-chip memory density.
Maximum bandwidth, effective routing and logic utilization, and optimized power efficiency are made possible by an innovative embedded HBM controller and ground-breaking integration for workloads that process large datasets from AI inference, video transcoding, next-generation firewalls, search applications, and data warehouses.
Increasing Adoption in Graphics Cards and High-Performance Computing (HPC): HBM technology has been widely adopted in graphics cards for applications such as gaming, artificial intelligence, and data centers due to its high bandwidth and power efficiency. HPC applications, including supercomputers and servers, also benefit from HBM’s high-performance capabilities.
Advancements in HBM Versions: Manufacturers have been developing newer versions of HBM, such as HBM2, HBM2E, and HBM3. Each iteration aims to enhance bandwidth, capacity, and power efficiency, catering to the evolving needs of various industries.
Integration into Emerging Technologies: HBM is being integrated into emerging technologies like artificial intelligence, machine learning, autonomous vehicles, and 5G infrastructure to support the enormous data processing requirements and bandwidth demands of these applications.
Rise in Data-Centric Applications: With the proliferation of data-centric applications, the demand for high-speed memory solutions like HBM has increased. Data-intensive workloads in industries such as finance, healthcare, and scientific research are driving the need for faster memory technologies.
Market Competition and Cost Reduction: Increased competition among HBM manufacturers is expected to lead to cost reductions, making HBM more accessible to a broader range of applications and industries. This cost optimization may encourage further adoption across various sectors.
Focus on Power Efficiency: As energy efficiency becomes a crucial consideration, efforts are ongoing to develop HBM variants that offer higher performance while consuming less power, catering to mobile devices and other energy-sensitive applications.
Research and Development: Ongoing research and development efforts are aimed at improving the scalability, reliability, and performance of HBM technology. This includes exploring advanced packaging techniques, materials, and stacking technologies to further enhance HBM’s capabilities.
Samsung Electronics has been a pioneer in the development of HBM technology, consistently introducing innovative advancements that have significantly enhanced the performance and capabilities of this high-performance memory. Here’s a look at some of Samsung’s recent HBM launches:
Announced in October 2023, Samsung’s HBM3E “Shinebolt” memory sets a new benchmark for HBM performance, offering up to 9.8Gbps memory speed, a 50% increase over the previous generation HBM3 memory. This groundbreaking technology is designed to address the ever-increasing demand for high-bandwidth memory in demanding applications such as high-performance computing (HPC) and AI accelerators.
Introduced in May 2023, Samsung’s HBM3P memory brings processing-in-memory (PIM) capabilities to the HBM family for the first time. PIM enables memory to perform processing tasks, offloading work from the processor and improving overall system performance. This innovative memory is tailored for use in mobile devices, where power efficiency and performance optimization are crucial.
Announced in February 2023, Samsung’s HBM3S “Stacked” memory introduces a revolutionary stacked memory architecture that vertically integrates multiple memory dies onto a single silicon substrate. This innovative approach not only enhances memory density but also reduces power consumption and improves thermal performance.
These recent launches demonstrate Samsung’s commitment to pushing the boundaries of HBM technology, continuously delivering innovative advancements that address the evolving needs of the high-performance computing landscape.
As the demand for high-bandwidth memory continues to grow, Samsung is well-positioned to maintain its leadership position in the High Bandwidth Memory (HBM) market with its cutting-edge technologies.
The future of HBM under Samsung’s leadership is bright. The company is actively exploring new avenues for HBM development, including integrating HBM with various chiplets and exploring new memory architectures to further enhance performance, efficiency, and scalability.
With its strong track record of innovation and commitment to excellence, Samsung is poised to play a pivotal role in shaping the future of HBM and shaping the memory landscape for demanding applications in the years to come.
Samsung Electronics: Samsung has been a prominent player in the High Bandwidth Memory (HBM) market, consistently advancing its HBM technology. The company introduced HBM2 and HBM2E solutions and continued research and development efforts to enhance performance, capacity, and energy efficiency.
SK Hynix: Another major player, SK Hynix, has been focusing on developing high-performance HBM solutions for various applications, particularly in the graphics card and data center segments. They have been involved in advancing HBM technology, exploring HBM3 and beyond to meet evolving market demands.
Micron Technology: Micron has also been actively involved in the High Bandwidth Memory (HBM) market, leveraging its expertise in memory technologies. The company has contributed to HBM2 advancements and has been exploring innovations to increase HBM capacity, bandwidth, and efficiency.
NVIDIA and AMD: These semiconductor giants have been integrating HBM technology into their high-end graphics cards for enhanced performance in gaming, AI, and other compute-intensive applications. They have been driving demand for HBM and collaborating with memory manufacturers to push the boundaries of HBM capabilities.
Intel: Intel has been investing in high-performance computing and data-centric technologies, including the integration of advanced memory solutions like HBM into its processors and accelerators. They have been exploring HBM in their architectures to boost performance in various applications.
Others: Companies like Xilinx, Fujitsu, and IBM, among others, have also been involved in HBM-related research and development, exploring its integration into specialized computing systems, data centers, and emerging technologies.
The Global High Bandwidth Memory (HBM) market can be segmented into following categories for further analysis:
Here is a list of some of the leading companies in the High Bandwidth Memory (HBM) market:
