GLOBAL ULTRA THIN CSP MARKET

INTRODUCTION

A thin IC and a thin substrate are used in a high-density packaging technique that utilises innovative flip-chip bonding technology.

Experiments and numerical analysis using the finite element approach made it abundantly evident that the IC thickness had an impact on dependability and IC deflection.

Consequently, lowering IC thickness could increase reliability. A shear stress value in the vertical cross section, which is calculated in the IC thickness and substrate type and thickness, respectively, might be used to describe the dependence of the life in double-sided CSPs

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GLOBAL ULTRA THIN CSP MARKET DEVELOPMENTS AND INNOVATIONS

Assuring the electrical connection for chip mounting on printed circuit boards and shielding IC chips from the environment are crucial functions of semiconductor packaging.

The rapid development of electronics technology, including artificial intelligence (AI) and cloud computing, is complemented by a high demand for integrated circuits (ICs) with high speed, high integration, and low power consumption.

During the last stage of the semiconductor manufacturing process, semiconductor packaging acts as a protective container to shield silicon wafers, logic chips, and memory from physical harm and corrosion. It makes it possible to attach the chip to a circuit board.

COMPETITIVE LANDSCAPE

Wafer Level Chip Scale Packaging (WLCSP) technology has experienced a three-dimensional (3D) scaling trend because of the miniaturisation of mobile electronics and consumer goods.

As we all know, the Covid-19 Outbreak has had a detrimental influence on the majority of industries worldwide during the past few months.

This can be ascribed to major disruptions in their respective production and supply-chain operations brought on by various safety lockdowns and other limitations imposed by governing bodies around the world.

Amkor Technology is a leading mobiliser of the equipment in the market. The latest integration has been the technology on a laminated or mould-based substrate, with or without a core; the fcCSP package is put together.

For production efficiency and cost reduction, the package is produced in a strip style, allowing for bare die, overmolded, and exposed die structures. Using an integrated heat spreader can help high-power devices manage their thermal issues.

Bottom side chip attach can be used to enable Antenna in Package (AiP).

ASE Technology is part of the component manufacture trending companies in the current industry. The latest integration has been the Quad Flat No-lead (QFN) or microchip carrier, which is based on a copper lead frame, uses half-encapsulation technology to expose the back of the die pad and the tiny fingers that are used to attach the chip and bonding wire to the PCB.

Applications requiring an operating frequency greater than 12GHz can use QFN packages. Due to its inexpensive materials and straightforward packaging procedure, QFN is a cost-effective packaging method that offers both thermal and electrical improvement.

COMPANIES PROFILED

• Amkor Technology, Inc.
• ASE Group
• ChipMOS Technologies, Inc.
• Powertech Technology, Inc.
• Fujitsu Ltd.
• Intel Corporation
• Texas Instruments
• Jiangsu Changjiang Electronics Technology Co., LTD 
• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company
• NipponMektron
• YoungPoongGroup
• Unimicron Technology
• Zhen Ding Tech
• Zhuhai Founder