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semiconductor chip is wrapped in a specific material as part of the “encapsulation process,” which shields packages from the outside environment. Additionally, it is a step that reveals the qualities of “light, thin, short, and small” that packages seek to achieve.
Encapsulation’s goal is to surround the component in protection without actually embedding it. It improves electrical insulation, flame retardancy, and heat dissipation while providing resistance to significant threats like shock, vibration, moisture, and corrosive agents.
Commonly used materials in packaging Cardboard boxes. Corrugated boxes. Glass Containers. Shrink Wrap. Cling Film. Woven Sack. Jute Bags. Intermediate Bulk Containers. Epoxy and acrylate resin based sealing and molding compounds are often used in electronics to protect electronic components, semiconductors and subassemblies. The encapsulation protects components from moisture, dust, dirt and solvents.
Global semiconductor encapsulation material market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Panasonic Launches Delamination-free Semiconductor Encapsulation Material CV8213 Designed to Improve the Reliability and Extend the Operating Life of Semiconductor Packages.
Panasonic Corporation announced the commercialization of a new delamination-free semiconductor encapsulation material designed for semiconductor packages use in automotive and industrial applications.
Full-scale production begins in January 2019. This product improves the reliability and extends the life of semiconductor packages operating in elevated temperature environments.
The operating temperatures of the power semiconductors used in automotive and industrial equipment applications are rising.
Reduced device sizes, higher current operation, and more modular designs are the causes of this trend. Interfacial adhesion loss between the lead frame (*2) and semiconductor encapsulation material is a common cause of failures in semiconductor packages, especially those used in high-temperature environments.
Differences in the linear coefficient of expansion characteristics between the lead frame and the encapsulating material frequently cause this kind of delamination.
Panasonic has released a new delamination-free semiconductor encapsulation material that uses a special resin design in conjunction with reaction control technology to solve this issue. This item meets the AEC-Q100, Q101/Grade 0 ( reliability standard for automotive electronic components.
In Panasonic, More functionality is being incorporated into smaller form-factor goods by electronic designers and producers. As a result of this trend, semiconductor packaging methods have been developed and are being widely used to produce packages with a smaller footprint and lower profile.
Due to the enormous number of semiconductors that can be contained in each molded panel, PLP promises a significant reduction in costs. These semiconductor packages’ encapsulation materials must display great adherence to the other structures in the package and must uniformly encapsulate large-area formats like wafers and panels without warping. These demands are met by the recently released granular epoxy mold compounds.
Encapsulation materials are in demand due to the growing popularity of electronic devices like smartphones, tablets, and wearables. This expansion in the semiconductor market is also fueling the demand for these materials.
In addition, it is believed that the quick development of technology, such as 5G networks, the Internet of Things (IoT), and artificial intelligence (AI), would further fuel the demand for semiconductor devices and raise the demand for encapsulating resins.
The demand for smaller and more compact semiconductor devices is also increasing as a result of the miniaturization trend that the electronics industry is experiencing, necessitating effective encapsulating materials with excellent thermal stability and performance.
The development of new and enhanced resin formulations that offer these qualities is likely to promote market growth. The market for semiconductor encapsulation resin is also expanding as a result of the growing emphasis on renewable energy sources and the rising popularity of electric vehicles (EVs).
The encapsulating materials provide protection against severe conditions, enhancing the reliability and durability of the devices. These industries use semiconductor devices for power electronics.
Encapsulation enhances assembly handling and shields the delicate semiconductor die, bond wires, and lead frame from outside influences including shock, moisture, and contamination. Epoxy material molding compounds are the most often used packaging materials.
These are made up of the titular epoxy resin, inorganic fillers like fused or crystalline silica, and additives that enhance workability during molding and enhance the qualities of the end product.
Hardeners, accelerators, flexibleness, pigments, flame-retardants, coupling agents, releasing agents, and flame-retardants are a few examples of often used additives.
Because the packaging material comes into touch with the semiconductor die and bond wires, its qualities have a direct bearing on dependability. Care must be taken when selecting a packaging material to prevent device failure due to warpage, layering, cracking, or corrosion brought on by moisture penetration.
Semiconductor manufacturers often purchase molding compounds from specialized outside suppliers, who offer a variety of compound types with tailored compositions for particular products. Chip manufacturers need extensive methods for quality assurance because only the supplier is aware of the precise composition.
