By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
In a continuous process, the three-dimensional X-ray inspection of PCBs captures both their top and bottom sides. AXOI combines X-ray inspection with an AOI module to perform inspection tasks that cannot be accomplished by X-ray alone.
Present Registration Certificate. Records of radiation badge reports pertaining to personal monitoring respond to public polls. The three most recent Equipment Performance Evaluations (EPE) results for each X-ray unit.
X-ray photons are the heavy and concentrated beam of electrons that the machine produces. After passing through the air, the photons come into contact with the body’s tissues and form an image on a metal film. Organs and other soft tissues cannot absorb the high-energy rays from the beam. By utilizing two distinct image acquisition concepts, the system can be adapted to the customer-specific test strategies and is available in a variety of speed configurations.
The Global 3D x-ray inspection system market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The G-PEL electronic AXI systems are adaptable. The inspection of BGA, QFN, THT, LED, and LGA solder joints is one of the standard responsibilities. A PCB’s other solder joints, whether they are visible or not, can also be examined.
The 3D planar CT method is also used to inspect press-fit connectors. There are no reflections or shadows typical of the AOI that could affect the X-ray inspection. The material’s absorption, which varies in density and thickness, serves as the foundation for the inspection. The X-ray inspection has no effect on a surface’s color or gloss level.
Multiple digital, bidirectionally scanning line detectors (MultiAngle Detector) are included in the X Line systems. The MultiAngle Detector makes it possible to simultaneously acquire images in 2.5D, 3D, and 2D. X-ray images are directly acquired as they move, in contrast to flat-panel detectors, which acquire images by using stop-and-go motion. As a result, cycle times are cut down and image acquisition times are reduced.
The programmer can adjust the 2D, 2.5D, and 3D image acquisition times to match the available cycle time. It is also possible to set how many oblique projections are used to reconstruct a 3D X-ray image. To achieve maximum inspection coverage, the offline programming software allows for the selection of 2D, 2.5D, or 3D technology in accordance with the inspection task.
