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Mini LED die are physically and electrically glued to substrates for packing after being sorted and numbered. Precision and speed are needed for this automated two-step pick-and-place procedure. First, the correct die is located using machine vision by a robotic micro-gripper, which then removes it from the input carrier.
The gripper is then precisely guided to the bonding location for installation by a second machine vision system, which also locates the destination on the substrate. Both procedures require precision.
Over the course of a machine’s life, improper vision alignment can result in thousands of helps (human interventions needed during the automation process) and thousands of damaged die. Equipment manufacturers lose market share, experience poorer throughput, and incur significantly higher service costs as a result of subpar vision systems.
To assist prevent these issues, Cognex Vision Pro software offers reliable, precise, and quick pattern localization for aligning micro LED die during the bonding process.
The PatMax unique geometric pattern-finding vision tool precisely locates each die’s placement on the target substrate as well as where it is quickly located on the carrier for selecting.
In comparison to pixel intensity-based locating tools, PatMax performs more precisely, is more sensitive to fluctuations in parts and presentation, and consistently performs to guarantee a high-quality, repeatable bonding process. OEMs can raise yields, enhance quality, and optimize the overall operation of their machinery with Cognex.
The Global Mini LED High-speed Die Bonder market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
A high performance die bonder for the photonics industry’s accurate and high volume device assembly needs is the Mini LED High-speed Die Bonder launched by Palomar, Palomar 6532HP.
The 6532HP is a device assembly system that combines a high volume presentation station with a high precision bonding station to meet the demanding requirements of the photonics market. A high speed die shuttle is used to rapidly and seamlessly transfer components from the presentation station to the bonding station.
