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A photonic integrated circuit (PIC) or integrated optical circuit (IOC) is a microchip that has two or more photonic components that work together to produce a working circuit. Light is detected, generated, transported, and processed using this technology.
Photonic integrated circuits use photons (or light particles) rather than electrons, which are used by electronic integrated circuits. The primary distinction between the two is that a photonic integrated circuit performs tasks for information signals imposed on optical wavelengths, often in the visible or near-infrared region.
Indium phosphide (InP) is the most often used commercial material platform for photonic integrated circuits because it enables the integration of diverse optically active and passive functionalities on the same chip. Simple distributed Bragg reflector (DBR) lasers were the first instances of photonic integrated circuits.
Unlike in electronic integration, where silicon is the dominant material, system photonic integrated circuits have been made from a variety of material systems, including electro-optic crystals like lithium niobate, silica on silicon, silicon on insulator, various polymers, and semiconductor materials like GaAs and InP, which are used to make semiconductor lasers.
The various material systems are chosen because they each have distinct benefits and drawbacks depending on the function to be incorporated.
For example, due to their comparatively low losses and low thermal sensitivity, silica (silicon dioxide) based PICs have very desirable properties for passive photonic circuits such as AWGs (see below), GaAs or InP based PICs allow direct integration of light sources, and Silicon PICs enable photonics co-integration with transistors.
Photolithography is used to shape wafers for etching and material deposition, comparable to processes used in electrical integrated circuits. In contrast to electronics, where the principal device is the transistor, there is no single dominating device in biology.
Low loss interconnect waveguides, power splitters, optical amplifiers, optical modulators, filters, lasers, and detectors are among the components required on a chip. These devices need a wide range of materials and fabrication processes, making it challenging to realize them all on a single chip.
PICs can be used in sensor systems such as Lidar (light detection and ranging) to monitor the surroundings of vehicles. It is also possible to establish in-car networking through Li-Fi, which is similar to WiFi but uses light.
This technology improves driver safety by facilitating communication between automobiles and urban infrastructure. Some contemporary automobiles, for example, detect traffic signs and alert the driver to the speed limit.
Engineers can utilize fiber optic sensors to measure many variables such as pressure, temperature, vibrations, accelerations, and mechanical strain. PhotonFirst’s sensing technology uses integrated photonics to monitor things like aircraft form changes, electric car battery temperature, and infrastructure strain.
The Global PIC Optical Engine Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Jabil Photonics Announces the Release of Next-Generation Coherent Optical Products with Nokia’s Silicon Photonics Optical Engine for Best-in-Class Performance.
They revealed that their photonics business unit is still driving the design and development of world-class optical communications devices, with the wide availability and customer testing of their CFP2 DCO ECO Coherent Transceiver.
This updated module, which is based on Nokia’s CSTAR200+ silicon photonics optical engine, is intended to provide best-in-class optical performance while conforming to current communications standards requirements. This second-generation coherent optical module will be demonstrated at the Jabil Photonics exhibit.
Jabil Photonics provides coherent technology and solutions for a wide range of applications, including metro networking and data-center interconnects.
Furthermore, using the latest Digital Signal Processing (DSP) and optical-engine technology, the second-generation modules meet the most recent communications standards requirements while minimizing power usage.
Jabil Photonics enables organizations to decrease the complexity associated with creating and delivering advanced optical networking solutions by providing end-to-end photonics skills and competences that include component design, system assembly, and simplified supply chain management.
With the industry’s first large-scale PIC, Infinera pioneered photonic integration and continues to lead the industry with its sixth-generation PIC in ICE6. Infinera’s PICs integrate a wide range of optical capabilities on a single chip by using high-performance indium phosphide (InP).
This lowers the cost, footprint, and power consumption while increasing performance and dependability. Furthermore, Infinera is the only equipment manufacturer that has spent extensively in building its own state-of-the-art indium phosphide PIC fab.
Aside from the obvious economic benefits of vertical integration, it enables quick redesigns for optimized performance, stringent quality control, and a faster ramp to volume for new technologies and products like sixth-generation Infinite Capacity Engine (ICE6).
