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New AI capabilities support automated programming, fine tuning, library creation, and image optimization in a fully automated 3D CT X-ray inspection.
Advanced inspection is being provided by CT technology for constraint-free PCBA design. Automated logics that combine advanced AI-driven easy programming with IPC standards.
Programming and tuning for the in-line process completely off-line without interfering with production. All PCBA devices, including BGA, BGA, LGA, Flip Chip, PoP, QFN, THT, Press-fit, and all discrete devices, are subject to comprehensive inspection logics.
Industrial 4.0 Smart Factory Solutions’ implementation of IoT for Manufacturing and full 3D-CT data processing Omron Advanced Process Software Tools are compatible with the VT-X750 in order to achieve Zero Defect Manufacturing.
Q-upNavi Omron: For true root-cause process analysis and process improvement, combine SPI, AOI, and AXI inspection result data. Q-upAuto from Omron: Advanced Manufacturing Analysis Using Manufacturing Process Data and Q-upNavi Inspection Result Data for High-Level Process Improvement
The Global 3D-CT Automated X-Ray Inspection System market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The new VT-X750-V3 system, the world’s fastest CT-type X-ray inspection device (*2) to date, will be made available to the general public on November 20, according to OMRON Corporation, based in Kyoto, Japan.
To meet the growing requirements of fifth-generation mobile communication systems (5G), electric vehicles (EVs), and autonomous driving application products, the VT-X750-V3 provides advanced, true 3D inspection of electronic substrates.
Through high-speed, PCB design-constraint-free, 100% X-ray inspection of electronic substrate assemblies, OMRON contributes to society’s security and safety while simultaneously ensuring the quality of customer products.
As a high-definition, high-quality full 3D-CT inspection, the X750 is used for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components.
The VT-X750 has been used in recent years to inspect solder voids and fill through-hole connectors with solder in the final assembly of power devices like IGBTs and MOSFETs, which are crucial for EVs, as well as Integrated machine and electric power. It has also been used extensively in semiconductors, industrial equipment, and aerospace.
The automated inspection logic has been enhanced for numerous components, including IC heal fillets, stacked devices (PoP), through hole components, press-fit connectors, and other bottom terminated parts, making the VT-X750 the fastest X-ray inspection system to date .
