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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
9DoF IMU Breakout, a Qlik-enabled breakout board that includes a logic shifter and broken-out GPIO pins for all motion sensing requirements.
9-axis motion tracking device with I2C and SPI capabilities that is incredibly power-efficient and perfectly suited for use with wearable sensors, smartphones, tablets, and Internet of Things applications.
No soldering is necessary to link it to the rest of your system using our convenient Qlik system. However, if you'd rather utilize a breadboard, we still have broken out 0.1"-spaced pins available.
The ICM includes a Digital Motion Processor that offloads the computation of motion sensing algorithms from the detectors, allowing the sensors to perform at their best.
This processor works in conjunction with the 3-Axis Gyroscope with four selectable ranges, 3-Axis Accelerometer, also with four selectable ranges, and 3-Axis Magnetometer with an FSR.
For simplicity of identification, we have also separated out all of the ICM pin functions to GPIO and labelled them on the front, SPI on the back.

The global 9-DoF IMU breakout board market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The Adafruit, a high-precision nine degrees of freedom (9DoF) inertial measurement unit (IMU), has been released by Adafruit and is intended for use with breadboards and STEMMA QT/Qlik. Adafruit describes its newest design as "this small breakout has two chips that sit side-by-side to offer 9 degrees of full-motion data." " The board has a 6-DoF IMU accelerometer and gyro along with an LSM6DSOX.
By sensing gravity, the 3-axis accelerometer can tell you which way is down towards the Earth or how quickly the board is accelerating in 3D space. Spin and twist can be measured with a 3-axis gyroscope.
In comparison to the MPU6050 or even the LSM6DS33, this new ST sensor has a very low gyro zero rate and noise level, making it a fantastic choice for orientation fusion applications because you'll receive quicker responses and less drift.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |