Europe Radiation-Hardened Electronics Market 2024-2030
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Europe Radiation-Hardened Electronics Market 2024-2030

Last Updated:  Apr 25, 2025 | Study Period: 2024-2030

EUROPE RADIATION-HARDENED ELECTRONICS MARKET

 

INTRODUCTION

Radiation-Hardened Electronics are additionally insulated in a layer of depleted boron and installed on insulating substrates rather than typical semiconductor wafers as part of the "hardening" process.

 

This allows them to endure far more radiation than commercially available semiconductors. 

 

Infographic : Europe Radiation-Hardened Electronics Market, Europe Radiation-Hardened Electronics Market Size, Europe Radiation-Hardened Electronics Market Trends, Europe Radiation-Hardened Electronics Market Forecast, Europe Radiation-Hardened Electronics Market Risks, Europe Radiation-Hardened Electronics Market Report, Europe Radiation-Hardened Electronics Market Share

 

All of these efforts are aimed at preventing both physical and logical harm, such as data loss or communications and processing failures, which could cause equipment to malfunction.

 

EUROPE RADIATION-HARDENED ELECTRONICS MARKET SIZE AND FORECAST

 

The Europe Radiation-Hardened Electronics Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

 

NEW PRODUCT LAUNCH IN EUROPE RADIATION-HARDENED ELECTRONICS MARKET

STMicroelectronics (ST) has released low-cost radiation-hardened integrated circuits for 'New Space' satellites.ST is making it easier to design and mass produce a new generation of reliable small, low-cost satellites that will supply services like earth observation and broadband internet from low-earth orbits (LEOs).

 

The electronic circuitry of the satellites relies heavily on ST's new generation of radiation-hardened power, analogue, and logic ICs in low-cost plastic packages.

 

Renesas Electronics Corporation, a leading provider of advanced semiconductor solutions, has introduced a new range of radiation-hardened (rad-hard) devices for satellite power management systems that are packaged in plastic.

 

The ISL71001SLHM/SEHM point of load (POL) buck regulator, the ISL71610SLHM and ISL71710SLHM digital isolators, and the ISL73033SLHM 100V GaN FET and integrated low-side driver are among the four new products.

 

The new portfolio delivers space-grade solutions to medium/geosynchronous Earth orbit (MEO/GEO) missions with extended lifetime requirements, as well as small satellites (smallsats) and higher density electronics, while reducing size, weight, and power (SWaP) costs.

 

EUROPE RADIATION-HARDENED ELECTRONICS MARKET NEW TECHNOLOGY

 

High-Performance, Radiation-Hardened Electronics for Space and Lunar Environments. The Radiation Hardened Electronics for Space Environments (RHESE) project creates the cutting-edge technologies necessary for high-performance electronic equipment that can function in the harsh radiation and heat extremes of the space, lunar, and Martian environments.

 

The avionics within numerous mission elements of NASA's Vision for Space Exploration, including the Orion Crew Exploration Vehicle of the Constellation programme, the Lunar Lander project, Lunar Outpost elements, and Extra Vehicular Activity (EVA) elements, are enhanced and made possible by the technologies developed under this project.

 

The RHESE project, its many goals, technological methodologies, and desired advantages as they relate to NASA missions are all described in this document.The NASA Exploration technological Development Programme (ETDP) includes several technological development initiatives, including the RHESE project.

 

This programme exists to guarantee that the necessary enabling and enhancing technologies are available to support NASA's current and future missions. A wide range of methods for protecting space electronics from the radiation and heat extremes of the space environment are offered by the RHESE project.

 

New materials, design methodologies, strategies for reconfigurable hardware, and software modelling tools are all examples of hardening approaches.

 

The missions being developed under NASA's Constellation programme within the Exploration Mission Systems Directorate (ESMD), including the lunar and Mars missions that will serve to achieve the goals of the Vision for Space Exploration, will be the primary customers of RHESE technologies (NASA, 2004).

 

The lunar capabilities of the Orion Crew Exploration Vehicle (CEV), the Lunar Lander project, Lunar Outpost components, and Extra Vehicular Activity (EVA) components are all applicable Constellation programme tasks.

 

RHESE technology also finds use in NASA research missions, joint projects with other US government organisations, and commercial applications. The RHESE project is overseen by the Marshall Space Flight Centre (MSFC) of NASA.

 

EUROPE RADIATION-HARDENED ELECTRONICS MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

  1. What is the average cost perEurope Radiation-Hardened Electronics Marketright now and how will it change in the next 5-6 years?
  2. Average cost to set up aRadiation-Hardened Electronics MarketinEurope?
  3. How manyEurope Radiation-Hardened Electronics Marketsare manufactured per annum globally? Who are the sub-component suppliers in different regions?
  4. What is happening in the overall public, globally?
  5. Cost breakup of aEurope Radiation-Hardened Electronics Marketand key vendor selection criteria
  6. Where is theEurope Radiation-Hardened Electronics Market manufactured? What is the average margin per equipment?
  7. Market share ofEurope Radiation-Hardened Electronics Marketmanufacturers and their upcoming products
  8. The most important plannedEurope Radiation-Hardened Electronics Marketin next 2 years
  9. Details on network of majorEurope Radiation-Hardened Electronics Marketand pricing plans
  10. Cost advantage for OEMs who manufactureEurope Radiation-Hardened Electronics Marketin-house
Sl noTopic
1Market Segmentation
2Scope of the report
3Abbreviations
4Research Methodology
5Executive Summary
6Introduction
7Insights from Industry stakeholders
8Cost breakdown of Product by sub-components and average profit margin
9Disruptive innovation in the Industry
10Technology trends in the Industry
11Consumer trends in the industry
12Recent Production Milestones
13Component Manufacturing in US, EU and China
14COVID-19 impact on overall market
15COVID-19 impact on Production of components
16COVID-19 impact on Point of sale
17Market Segmentation, Dynamics and Forecast by Geography, 2024-2030
18Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030
19Market Segmentation, Dynamics and Forecast by Application, 2024-2030
20Market Segmentation, Dynamics and Forecast by End use, 2024-2030
21Product installation rate by OEM, 2023
22Incline/Decline in Average B-2-B selling price in past 5 years
23Competition from substitute products
24Gross margin and average profitability of suppliers
25New product development in past 12 months
26M&A in past 12 months
27Growth strategy of leading players
28Market share of vendors, 2023
29Company Profiles
30Unmet needs and opportunity for new suppliers
31Conclusion
32Appendix