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The manufacturing of volume CMOS (MOSFET) semiconductors uses the 65 nm technology, a cutting-edge lithographic node. While the pitch between two lines may be higher than 130 nm, printed linewidths (i.e. transistor gate lengths) can be as low as 25 nm using a process with a nominal pitch of 65 nm.
Numerous applications, including those for mobile devices, computers, automotive electronics, the Internet of Things, and smart wearables, are supported by 65nm technology. The third-generation semiconductor process used by the company, 65nm technology, has both low-k dielectrics and copper interconnects. The technology allows for standard cell gate densities that are twice as high as those of 90nm processes. It delivers enhanced chip performance and greater integration.
The Global 65nm chip market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
For usage in wireless phones, Infineon Technologies developed their groundbreaking 65-nanometer chips. According to a press release from the German semiconductor manufacturer, the 65nm CMOS chips passed a stringent testing regimen in Germany and India without a hitch.
For semiconductor manufacturers looking to quadruple chip capacity without also increasing chip size and power consumption, the 65nm boundary has been a target.
According to Infineon, the chip under evaluation includes transmitters and fits the bulk of the digital and analogue circuitry used in small cell phones. Infineon, IBM, Chartered, and Samsung, produced the chip. 65 nm products are also being developed by Intel and Altera.
