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Heat dissipative materials are materials that are designed to rapidly and efficiently dissipate heat away from a given space or surface. This is an important property in the fields of electronics and communications, as the efficiency of a device or system is often directly linked to the amount of heat it produces.
Heat dissipative materials are used to reduce the temperature of a system by efficiently transferring the heat away from the source. Commonly used heat dissipative materials are metalized polymer films, graphite-based materials, and high-performance ceramics.
Metalized polymer films are composed of a metalized layer of a polymer film that is highly conductive. This layer of the film helps to disperse heat away from the device or system by increasing the surface area of the material.
Graphite-based materials are composed of a combination of several different graphite-based materials and are designed to act as a thermal barrier, keeping heat away from the device or system.
High-performance ceramics are also used in heat dissipative materials as they are able to absorb and disperse heat away from the device or system.
Heat dissipative materials are used in a variety of electronic and communication applications, such as in computers, mobile phones, and other electronic devices. In addition to their use in electronics, heat dissipative materials are also used in industrial applications, such as in manufacturing and construction.
Heat dissipative materials are essential in ensuring that a device or system can function at its optimal level, by dissipating the heat away from the source.
The Global Heat Dissipative materials market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The development of materials with effective heat dissipation capabilities is crucial for flexible smart devices and next-generation integrated circuits. Here, a simple solution dip-coating method using graphene oxide (GO) on polyimide (PI) skeletons, followed by high-temperature annealing, is used to develop a 3D hybridised carbon film featuring graphene nanowrinkles and microhinge structures.
This design offers superflexibility and ultrahigh thermal conductivity in both the through-plane (150 ± 7 W m-1 K-1) and in-plane (1428 ± 64 W m-1 K-1) directions for the graphitized GO/PI (g-GO/PI) film. Its usefulness as a thermal interface material further reveals its superior heat management capability as compared to aluminium foil.
More crucially, a novel type of carbon sheet origami heat sink is developed and shown, which outperforms copper foil in terms of heat extraction and heat transfer for high-power devices by linking the hyper metallic thermal conductivity in two directions.
The g-GO/PI carbon film’s hyper metallic heat dissipation performance not only demonstrates the material’s potential as an emerging thermal management tool, but it also offers a simple and workable path for designing next-generation heat dissipation components for flexible smart devices that consume a lot of power.
The world’s best heat dissipation performance of a high-thermally-conductive carbon nanotube sheet has been successfully developed, according to Fujitsu Laboratories Ltd. The sheet has remarkable heat resistance and thermal conductivity since it is made entirely of perpendicularly oriented, pure carbon nanotubes (manufactured without the use of rubber or resin).
Fujitsu Labs has also developed a sheet-forming technology that removes heat from SiC power modules by heat-treating oriented-growth carbon nanotubes at temperatures higher than 2000 degrees C.
This process produces sheets that are lightweight and portable. In addition to exploring growing its business into new markets such as applications for next-generation high-performance computer and telecommunications equipment, Fujitsu Labs wants to employ this technology in automobile heat-dissipation materials starting in fiscal year.
